iPhone 17 Pro Max
ƒ/1.78
6.7649998656528 mm
1/30
500

Earlier attempts at wafer-scale integration had yield issues. Here the lithography-reticle-sized rectangles interconnect only with upper layer metal, and each has a local clock, so it’s almost like a wafer-scale multi-chip module.

It can can route around regional failures. This architecture is OK for AI and avoids earlier WSI shortcomings.

With 44GB of SRAM (6T cell, 1 ECC bit per byte), I calculate that approximately 60% of its 4 trillion transistors are for memory.

I took a short video pan across the surface

2 responses to “Cerebras AI Wafer”

  1. The rainbow lines are at the edges of lithography reticles (where the registration for upper level metal lines can be more forgiving):

  2. Tell Andrew I say hi

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