
iPhone 17 Pro Max
ƒ/1.78
6.7649998656528 mm
1/30
500
Earlier attempts at wafer-scale integration had yield issues. Here the lithography-reticle-sized rectangles interconnect only with upper layer metal, and each has a local clock, so it’s almost like a wafer-scale multi-chip module.
It can can route around regional failures. This architecture is OK for AI and avoids earlier WSI shortcomings.
With 44GB of SRAM (6T cell, 1 ECC bit per byte), I calculate that approximately 60% of its 4 trillion transistors are for memory.
I took a short video pan across the surface

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